MPW Schedules 2024
Imec.IC-link offers the Multi-Project Wafer (MPW) services through leading foundries and fabs. Find out the scheduled runs below.
If you are interested in small ASIC designs, we can offer you a service called the mini@sic via EUROPRACTICE.
Please, feel free to contact us if you have any questions.
UMC
Important notes:
- Dates are GDS submission deadlines. Design registration must be done at least 3 weeks in advance.
- Additional technology options are available.
- Dates are GDS submission deadlines.
- Several TSMC shuttles are extremely loaded. For any technology, please make your design registration as early as possible. We will work with you and do our best to get your design on the run. If required, a waiting list will be created.
- Bumping is available upon request for all 12-inch technologies.
- Contact eptsmc@imec.be if any of the following options are used: Bumping, MTP/OTP, Deep Trench, High Linearity MiM, Schottky Barrier Diode, ULL N/PMOS.
Imec
Important notes:
- Dates indicate deadlines for submission of the first version of the GDS file.
- Registration for a given shuttle closes one month before the dates indicated on the table.
Important notes:
- Dates indicate deadlines for submission of the first version of the GDS file.
- Registration for a given shuttle closes one month before the dates indicated on the table.
- The administrative procedure must be finished at least 1 week before the dates indicated on the table.
X-FAB
Important notes:
- Dates are GDS submission deadlines. Registration should be done at least 2 weeks in advance.
- *In case of cancellation, there is a possibility to order these technologies by MLM.
- Please take a look at additional technology options.