MPW Schedules
Imec.IC-link offers the Multi-Project Wafer (MPW) services through leading foundries and fabs. Find out the scheduled runs below.
If you are interested in small ASIC designs, we can offer you a service called the mini@sic via EUROPRACTICE.
Please, feel free to contact us if you have any questions.
TSMC
Important notes:
- Dates are GDS submission deadlines. Design registration must be done at least 3 months in advance.
- Bumping is available upon request for all 12-inch technologies.
- Contact eptsmc@imec.be if any of the following options are used: Bumping, MTP/OTP, Deep Trench, High Linearity MiM, Schottky Barrier Diode, ULL N/PMOS.
- Dates in dark grey are preliminary.
UMC
Important notes:
- Dates are GDS submission deadlines. Design registration must be done at least 3 weeks in advance.
- Additional technology options are available.
XFAB
Important notes:
- Dates are GDS submission deadlines. Registration should be done at least 2 weeks in advance.
- Additional technology options are available.
- *In case of cancellation, there is a possibility to order these technologies by MLM.
ONsemi
Important notes:
- Dates are GDS submission deadlines. Design registration has to be done at least 3 weeks in advance.
- Dates in dark grey are preliminary.
imec
Important notes:
- Dates indicate deadlines for both Registration and submission of the first version of the GDS file.