2026 TSMC Europe OIP Ecosystem Forum

IC-Link and imec will be participating in 2026 TSMC Europe OIP Ecosystem Forum, the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss turning visionary ideas into reality. IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging. Join us to learn more on imec’s latest R&D breakthroughs and the manufacturing options through IC-Link:

BOOTH
IC-Link team will be present on the exhibit floor.
 

PRESENTATIONS
Coming soon.