AI Infra Summit 2025
September 09 - July 11, 2025 | Santa Clara, USA
Powering Fast, Efficient & Affordable AI
Imec
Join our workshop "New technology modalities for the AI fabric chipset: when advanced ASICs and photonics ICs come together with 3D packaging" by Philippe Sousan, on September 10, at 4 PM, in room 207.
About the workshop:
In the new era of AI infrastructure, CMOS scaling remains the workhorse for heavy computational workloads. But the need for an energy-efficient solution imposes a paradigm shift at the interconnect level, requiring an intimate 3D co-integration of advanced ASICs and optical connectivity.
As the architectural complexity of new products increases, relying on state-of-the-art platforms, with a short path to manufacturing. In this workshop, we will highlight how you can access following technologies for your future products:
- Advanced-node ASIC down to TSMC N2
- Imec’s integrated photonics platforms from 200G up to co-packaged optics
- Imec’s advanced 3D packaging technique from interposer to hybrid bonding.
Event
Originating as the AI Hardware Summit back in 2018, the summit has evolved from a semiconductor conference into a full-stack AI infrastructure event. The 2025 summit will attract 3,500 attendees and over 100 partners, with content designed for hardware providers, hyperscalers, and all enterprise IT and AI infrastructure specialists building fast, efficient, and affordable AI.
Alongside keynotes from industry-leading AI luminaries, the 4-track event will cover:
- Hardware & Systems
- Enterprise AI
- Edge AI
- AI Data Center
Save 10% when you register using code: IMECEVENT10