
Workshop and networking session, side event to the GSA European Executive Forum
Munich, June 10, 2026
AI workloads are making ever-higher demands on custom chips. To make sure hardware can keep up with AI growth, innovation is needed across multiple dimensions:
Ensuring that European companies, regardless of size or initial production volume, can access these technologies is critical to their future competitiveness. This is precisely where IC-Link by imec plays a vital role.
As a side event to the GSA European Executive Forum, IC-Link is organizing a networking session to foster exchange on practical pathways to next-generation AI hardware.
This networking session will:
| 8.30 a.m. | Registration and welcome coffee |
| 9.00 - 9:30 a.m. | From AI Ambition to Silicon reality: Europe's path to scalable impact | Pierre Blondeau, IC-Link by imec |
| 9.30 - 10:00 a.m. | Advanced Packaging in the Giga Watt datacenter era | Philippe Soussan, IC-Link by imec |
| 10.00 - 10.45 a.m. | Networking coffee break |
| 10.45 - 11.30 a.m. | Panel discussion: Reshaping the Semiconductor Value Chain: Build, Partner, or Integrate? | Cosmic Group, Equal1, Kalray, Q.ANT |
| noon | Start of the GSA European Executive Forum networking lunch |
This partner networking event will take place at the Maritim Hotel, near the station, and a short walk from the GSA European Executive Forum venue.
Do you also want to attend the GSA European Executive Forum? You can register for the event at a discount price. Use one of these promotion codes when registering on their website:
To ensure a balanced representation across companies, sectors and participants, we can only confirm your registration, by email, after we review your submission.